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New bond issue: Hengli Hong Kong Real Estate issued international bonds (XS1873112764) with a 4.75% coupon for USD 500.0m maturing in 2023

10 wrzesień 2018 | Cbonds

September 10, 2018 Hengli Hong Kong Real Estate issued international bonds (XS1873112764) with a 4.75% for USD 500.0m maturing in 2023. Bonds were sold at a price of 98.823% with an initial yield of 5.0821%. Depository: Clearstream Banking S.A., Euroclear Bank
Bookrunner: Bank of China, China Everbright Bank, Guotai Junan Securities, HSBC, ICBC, Industrial Bank, Shanghai Pudong Development Bank, UBS.

Issue: Hengli Hong Kong Real Estate, 4.75% 17sep2023, USD

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
W obrocieHong Kong17.09.2023500.000.000 USDBBB-/Baa3/BBB+

Organizacja: Hengli Hong Kong Real Estate

Pełna nazwa firmyHengli Hong Kong Real Estate Ltd.
Country of riskHong Kong
Country of registrationHong Kong
IndustryBudownictwo i rozwój

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