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New bond issue: Codelco issued international bonds (USP3143NBB93) with a 4.375% coupon for USD 1,300.0m maturing in 2049

29 styczeń 2019 | Cbonds

January 28, 2019 Codelco issued international bonds (USP3143NBB93) with a 4.375% for USD 1,300.0m maturing in 2049. Bonds were sold at a price of 93.054% with an initial yield of 4.815%. Bookrunner: Citigroup, HSBC, JP Morgan, ScotiaBank. Depository: Euroclear Bank, Clearstream Banking S.A.

Issue: Codelco, 4.375% 5feb2049, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
W obrocieChile05.02.20491.300.000.000 USDA3/A+/A-

Organizacja: Codelco

Pełna nazwa firmyCorporacion Nacional del Cobre de Chile
Country of riskChile
Country of registrationChile


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